•  On Nov, 16, 2012
•  DST

PVA sponge roller is used in many wet surface cleaning process.  Hard disc substrate and wafer cleaning process are the 2 cleaning processes that require high quality PVA sponge roller products.  Perhaps PVA sponge roller design could play a very important role for achieving better cleaning result. Once a wet surface cleaning process has been […]

•  On Oct, 27, 2012
•  DST

Chemical-Mechanical Planarization (CMP) process is the polishing process used in wafer and disc drive industry.  Many efforts have been discussed on setting up an appropriate CMP process however not emphasizes being given on post-CMP cleaning process.  In order to achieve a better surface appearance, CMP engineer should consider both the polishing process and post-CMP cleaning […]